Semiconductor light source and light curing apparatus

Centrally arranged LED chips (12,14,20) are directly mounted to a base body (22) using a thermally conductive connection. At least one printed circuit board (46), mounted on the base body, extends from the centrally arranged LED chips to the peripheral region of the base body.

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Bibliographische Detailangaben
Hauptverfasser: Senn, Bruno, Plank, Wolfgang
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:Centrally arranged LED chips (12,14,20) are directly mounted to a base body (22) using a thermally conductive connection. At least one printed circuit board (46), mounted on the base body, extends from the centrally arranged LED chips to the peripheral region of the base body.