Semiconductor light source and light curing apparatus
Centrally arranged LED chips (12,14,20) are directly mounted to a base body (22) using a thermally conductive connection. At least one printed circuit board (46), mounted on the base body, extends from the centrally arranged LED chips to the peripheral region of the base body.
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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Zusammenfassung: | Centrally arranged LED chips (12,14,20) are directly mounted to a base body (22) using a thermally conductive connection. At least one printed circuit board (46), mounted on the base body, extends from the centrally arranged LED chips to the peripheral region of the base body. |
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