POLYKETONE FIBER PAPER, POLYKETONE FIBER PAPER CORE MATERIAL FOR PRINTED WIRING BOARD AND PRINTED WIRING BOARD

An aliphatic polyketone fiber paper comprising aliphatic polyketone fibers and a polyketone fiber paper core material for a printed wiring board are provided. The polyketone fiber paper and the core material have high strength and modulus of elasticity; excellent dimensional stability, chemical resi...

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Bibliographische Detailangaben
Hauptverfasser:	SHIRATORI, NAOYUKI, HIGUCHI, MASAO, MATSUSHITA, FUMIO
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OF CARBONFILAMENTS CHEMICAL FEATURES IN THE MANUFACTURE OF ARTIFICIAL FILAMENTS,THREADS, FIBRES, BRISTLES OR RIBBONS IMPREGNATING OR COATING OF PAPER NATURAL OR ARTIFICIAL THREADS OR FIBRES PAPER NOT OTHERWISE PROVIDED FOR PAPER-MAKING PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D PRODUCTION OF CELLULOSE PULP COMPOSITIONS SPINNING TEXTILES TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G
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Beschreibung
Zusammenfassung:	An aliphatic polyketone fiber paper comprising aliphatic polyketone fibers and a polyketone fiber paper core material for a printed wiring board are provided. The polyketone fiber paper and the core material have high strength and modulus of elasticity; excellent dimensional stability, chemical resistance, heat resistance, adhesiveness and electrical insulation; and low dielectricity and water absorbance, and are thin, porous, and uniform. A printed wiring board prepared from the core material having a low dielectric constant, dimensional stability, electrical insulation, and properties of being uniformly bored by laser punching is also provided. The aliphatic polyketone fiber paper and the core material for a printed wiring board comprises 1 to 100% by mass of aliphatic polyketone fibers which comprise the repeating unit of the below-mentioned formula (1), the fibers having an average fiber length of 0.5 to 10 mm, an average fiber diameter of 0.1 to 20 µm, a thickness of 5 to 200 µm, a void ratio of 30 to 90%, and a strength per unit mass of 100 MN/kg or more. Also provided is a single layer or multilayer printed wiring board which comprises a core material impregnated or coated with a polymer resin, a low dielectric polymer resin, or a polyphenylene ether-based epoxy resin. -CH 2 -CH 2 -CO-(1)