Cerium oxide abrasive and method of polishing substrates
A cerium oxide abrasive comprising a slurry, the slurry comprising slurry particles including cerium oxide particles having a value of structural parameter Y of from 0.01 to 0.70, the structural parameter Y representing an isotropic microstrain of said cerium oxide particles obtained by a powder X-r...
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creator | YOSHIDA, MASATO MATSUZAWA, JUN OOTUKI, YUUTO TANNO, KIYOHITO KURATA, YASUSHI TERASAKI, HIROKI ASHIZAWA, TORANOSUKE |
description | A cerium oxide abrasive comprising a slurry, the slurry comprising slurry particles including cerium oxide particles having a value of structural parameter Y of from 0.01 to 0.70, the structural parameter Y representing an isotropic microstrain of said cerium oxide particles obtained by a powder X-ray Rietveld method with RIETAN-94; said cerium oxide particles being dispersed in a medium, wherein the slurry particles have a median diameter of from 150 nm to 600 nm, and primary particles having a median diameter of from 30 nm to 250 nm. |
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said cerium oxide particles being dispersed in a medium, wherein the slurry particles have a median diameter of from 150 nm to 600 nm, and primary particles having a median diameter of from 30 nm to 250 nm.</description><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM,CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THERARE-EARTH METALS</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>DYES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>INORGANIC CHEMISTRY</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>PAINTS</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHES</subject><subject>POLISHING</subject><subject>POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH</subject><subject>PREPARATION OF CARBON BLACK</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SKI WAXES</subject><subject>TRANSPORTING</subject><subject>TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS,TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2013</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLBwTi3KLM1VyK_ITElVSEwqSizOLAMy8lIUclNLMvJTFPLTFAryczKLMzLz0hWKS5OKS4oSS1KLeRhY0xJzilN5oTQ3g4Kba4izh25qQX58anFBYnJqXmpJvGuAoYWxsYGFiZOhMRFKALfcLhA</recordid><startdate>20130821</startdate><enddate>20130821</enddate><creator>YOSHIDA, MASATO</creator><creator>MATSUZAWA, JUN</creator><creator>OOTUKI, YUUTO</creator><creator>TANNO, KIYOHITO</creator><creator>KURATA, YASUSHI</creator><creator>TERASAKI, HIROKI</creator><creator>ASHIZAWA, TORANOSUKE</creator><scope>EVB</scope></search><sort><creationdate>20130821</creationdate><title>Cerium oxide abrasive and method of polishing substrates</title><author>YOSHIDA, MASATO ; 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said cerium oxide particles being dispersed in a medium, wherein the slurry particles have a median diameter of from 150 nm to 600 nm, and primary particles having a median diameter of from 30 nm to 250 nm.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM,CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THERARE-EARTH METALS DRESSING OR CONDITIONING OF ABRADING SURFACES DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING INORGANIC CHEMISTRY MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PERFORMING OPERATIONS POLISHES POLISHING POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH PREPARATION OF CARBON BLACK SEMICONDUCTOR DEVICES SKI WAXES TRANSPORTING TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS,TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES |
title | Cerium oxide abrasive and method of polishing substrates |
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