Cerium oxide abrasive and method of polishing substrates

A cerium oxide abrasive comprising a slurry, the slurry comprising slurry particles including cerium oxide particles having a value of structural parameter Y of from 0.01 to 0.70, the structural parameter Y representing an isotropic microstrain of said cerium oxide particles obtained by a powder X-r...

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Bibliographische Detailangaben
Hauptverfasser:	YOSHIDA, MASATO, MATSUZAWA, JUN, OOTUKI, YUUTO, TANNO, KIYOHITO, KURATA, YASUSHI, TERASAKI, HIROKI, ASHIZAWA, TORANOSUKE
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM,CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THERARE-EARTH METALS DRESSING OR CONDITIONING OF ABRADING SURFACES DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING INORGANIC CHEMISTRY MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PERFORMING OPERATIONS POLISHES POLISHING POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH PREPARATION OF CARBON BLACK SEMICONDUCTOR DEVICES SKI WAXES TRANSPORTING TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS,TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES
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Beschreibung
Zusammenfassung:	A cerium oxide abrasive comprising a slurry, the slurry comprising slurry particles including cerium oxide particles having a value of structural parameter Y of from 0.01 to 0.70, the structural parameter Y representing an isotropic microstrain of said cerium oxide particles obtained by a powder X-ray Rietveld method with RIETAN-94; said cerium oxide particles being dispersed in a medium, wherein the slurry particles have a median diameter of from 150 nm to 600 nm, and primary particles having a median diameter of from 30 nm to 250 nm.