System and method for monotoring drilling process parameters and controlling drilling operation

A system (210, 510, 610) which broadly comprises: (a) a plurality of sensors (222, 226, 522, 526, 532, 654) for monitoring one or more relevant laser drilling process parameters other than only breakthrough (262, 372, 728) during operation of a laser drill (105); and (b) optionally a controller (246...

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Bibliographische Detailangaben
Hauptverfasser: SCHEIDT, WILBUR DOUGLAS, MORABITO, JOHN LOUIS, ROCKSTROH, TODD JAY, ASH, CLARENCE A, SOMERS, RALPH MORGAN
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:A system (210, 510, 610) which broadly comprises: (a) a plurality of sensors (222, 226, 522, 526, 532, 654) for monitoring one or more relevant laser drilling process parameters other than only breakthrough (262, 372, 728) during operation of a laser drill (105); and (b) optionally a controller (246) that uses the one or more monitored laser drilling process control parameters to control a laser drill during operation (105) thereof. Also disclosed is a method which broadly comprises the following steps: (a) providing a plurality of sensors (222, 226, 522, 526, 532, 654) capable of monitoring one or more relevant laser drilling process parameters other than only breakthrough (262, 372, 728) during a laser drilling operation (105); (b) monitoring with the plurality of sensors (222, 226, 522, 526, 532, 654) one or more relevant laser drilling process parameters other than only breakthrough (262, 372, 728) during the laser drilling operation (105); and (c) optionally using the one or more monitored laser drilling process parameters to control (246) the laser drilling operation (105).