WEDGELOCK FOR ELECTRONIC CIRCUIT CARD MODULE

An arrangement for introducing a plate element, for which heat needs to be dissipated by means of conduction, into a slot of a chassis which is adapted to absorb the heat. The slot has a back wall adapted to contact the plate element upon its insertion, an opposing front wall, and a base wall. The plate element has margins adapted for carrying the arrangement. The arrangement comprises has a seat located on the margins. The arrangement further has a wedgelock moveably attached to the seat, having two slot engaging surfaces adapted to contact the front and base walls of the slot, and a seat engaging portion adapted to contact the seat. The arrangement further has an actuating mechanism adapted to cause a movement of the wedgelock in a direction toward the front wall and in a direction toward the base wall of the slot until a tight contact is established between the slot engaging surfaces of the wedgelock and the slot's front and base walls, while maintaining a tight contact between the seat engaging portion of the wedgelock and the seat and between the module and the back wall of the slot.