METHOD OF MODIFYING SURFACE AREA AND ELECTRONIC DEVICE
In the method a first layer, particularly of amorphous silicon, is deposited on the surface of a substrate with trenches. Part of this surface is covered with a protective layer. The first layer is thereafter maskless removed with a dry etching treatment on the substrate surface while it is kept wit...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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Zusammenfassung: | In the method a first layer, particularly of amorphous silicon, is deposited on the surface of a substrate with trenches. Part of this surface is covered with a protective layer. The first layer is thereafter maskless removed with a dry etching treatment on the substrate surface while it is kept within the trench. |
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