METHOD OF MODIFYING SURFACE AREA AND ELECTRONIC DEVICE

In the method a first layer, particularly of amorphous silicon, is deposited on the surface of a substrate with trenches. Part of this surface is covered with a protective layer. The first layer is thereafter maskless removed with a dry etching treatment on the substrate surface while it is kept wit...

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Bibliographische Detailangaben
Hauptverfasser: KLOOTWIJK, JOHAN, H, ROOZEBOOM, FREDDY, KEMMEREN, ANTONIUS, L., A., M, WOLTERS, ROBERTUS, A., M
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:In the method a first layer, particularly of amorphous silicon, is deposited on the surface of a substrate with trenches. Part of this surface is covered with a protective layer. The first layer is thereafter maskless removed with a dry etching treatment on the substrate surface while it is kept within the trench.