POSITIVE PHOTOSENSITIVE INSULATING RESIN COMPOSITION AND CURED PRODUCT THEREOF

Disclosed is a positive photosensitive insulating resin composition which comprises: (A) a copolymer comprising (A1) 10 to 99 mol% of a structural unit of the formula (1) and (A2) 90 to 1 mol% of a structural unit of the formula (2); (B) a quinone diazide group-containing compound; (C) at least one...

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Bibliographische Detailangaben
Hauptverfasser: INOMATA, KATSUMI, YOKOYAMA, KEN-ICHI, ITO, ATSUSHI, IWANAGA, SHIN-ICHIRO
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:Disclosed is a positive photosensitive insulating resin composition which comprises: (A) a copolymer comprising (A1) 10 to 99 mol% of a structural unit of the formula (1) and (A2) 90 to 1 mol% of a structural unit of the formula (2); (B) a quinone diazide group-containing compound; (C) at least one compound selected from the group consisting of (C1) an aromatic compound containing a methylol group and/or an alkoxy methyl group (except for aromatic compounds containing an amino group), (C2) an aromatic aldehyde compound, (C3) an aliphatic aldehyde compound, (C4) an alkyl-etherified amino group-containing compound and (C5) an epoxy group-containing compound; (D) a solvent; and (E) an adhesion assistant. Disclosed also is a cured product obtainable from the composition. wherein Ra and Rb are each an alkyl group having 1 to 4 carbon atoms, alkoxy group or aryl group, Rb and Rc are each hydrogen or a methyl group, n is an integer of 0 to 3 and m is an integer of 1 to 3. The cured product has excellent resolution, electrical insulating properties, thermal shock resistance, adhesion and other properties.