Method for mounting a flip chip on a substrate

The method involves placing a semiconductor chip (2) on a wafer table and capturing the image of the chip using a camera (8). The correction vectors describing the deviation of the actual position of the chip from the reference position are computed. The positions of the three movement axes are comp...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WERNE, DOMINIK, GRUETER, RUEDI, BLESSING, PATRICK
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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