Method for mounting a flip chip on a substrate
The method involves placing a semiconductor chip (2) on a wafer table and capturing the image of the chip using a camera (8). The correction vectors describing the deviation of the actual position of the chip from the reference position are computed. The positions of the three movement axes are comp...
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| Format: | Patent |
| Sprache: | eng ; fre ; ger |
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| Zusammenfassung: | The method involves placing a semiconductor chip (2) on a wafer table and capturing the image of the chip using a camera (8). The correction vectors describing the deviation of the actual position of the chip from the reference position are computed. The positions of the three movement axes are computed based on the correction vectors. The axes are moved to the computed positions and the chip is placed on the substrate. |
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