Method for mounting a flip chip on a substrate

The method involves placing a semiconductor chip (2) on a wafer table and capturing the image of the chip using a camera (8). The correction vectors describing the deviation of the actual position of the chip from the reference position are computed. The positions of the three movement axes are comp...

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Hauptverfasser:	WERNE, DOMINIK, GRUETER, RUEDI, BLESSING, PATRICK
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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creator	WERNE, DOMINIK GRUETER, RUEDI BLESSING, PATRICK
description	The method involves placing a semiconductor chip (2) on a wafer table and capturing the image of the chip using a camera (8). The correction vectors describing the deviation of the actual position of the chip from the reference position are computed. The positions of the three movement axes are computed based on the correction vectors. The axes are moved to the computed positions and the chip is placed on the substrate.
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title	Method for mounting a flip chip on a substrate
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