Chemical vapor deposition apparatus and methods of using the apparatus

A chemical vapor deposition apparatus (10) comprises a heating element (12) capable of emitting electromagnetic radiation; a retort (16) positioned relative to the heating element (12) to receive the electromagnetic radiation; an encasing member (18) at least partially disposed around the retort (16...

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Bibliographische Detailangaben
Hauptverfasser:	LEWIS, DANIEL JOSEPH, LOU, VICTOR LIENKONG, SAYLOR, MATTHEW DAVID, DALAKOS, GEORGE THEODORE, WEAVER, SCOTT ANDREW, RUCKER, MICHAEL HOWARD
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A chemical vapor deposition apparatus (10) comprises a heating element (12) capable of emitting electromagnetic radiation; a retort (16) positioned relative to the heating element (12) to receive the electromagnetic radiation; an encasing member (18) at least partially disposed around the retort (16), the encasing member (18) comprising a material that is at least partially transparent to the electromagnetic radiation; a plenum (20) defined at least in part by an inner surface (24) of the encasing member (18) and an outer surface (22) of the retort (16) ; and a furnace box (14) at least partially disposed around the encasing member (18) and the retort (16), and housing the heating element (12).