TIN-BASED PLATING FILM AND METHOD FOR FORMING THE SAME

The present invention provides a tin-based two-layered plating film exhibiting suppressed whisker growth comprising a lower layer of a tin plating film or tin alloy plating film comprising 5 % by weight or less of at least one metal selected from the group consisting of cobalt, copper, bismuth, silv...

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Bibliographische Detailangaben
Hauptverfasser:	KWOK, CHUN WAH, JIMMY, KWOK, YIM WAH, ROSALINE, NAKAGISHI, YUTAKA
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	The present invention provides a tin-based two-layered plating film exhibiting suppressed whisker growth comprising a lower layer of a tin plating film or tin alloy plating film comprising 5 % by weight or less of at least one metal selected from the group consisting of cobalt, copper, bismuth, silver, and indium, and 95 % by weight or more of tin, and an upper layer of a tin plating film or tin alloy plating film comprising 5 % by weight or less of at least one metal selected from the group consisting of cobalt, copper, bismuth, silver and indium, and 95 % by weight or more of tin. The tin-based plating film of the present invention is a lead-free tin plating film or tin alloy plating film, exhibits suppressed whisker growth over an extended period, and can further be formed relatively easily without complicated steps.