Electromagnetic shielding of packages with a laminate substrate

The invention is related to a method for manufacturing electronic modules from a moulded module strip 10 comprising a laminate 1 including at least one conductive layer 4, and one or more dies 2 and or surface mounted devices arranged on an upper surface of the laminate 1 and embedded by a_moulding compound 3. The method comprises the steps of: cutting partway through the laminate 1 reaching at least through the uppermost of the at least one conductive layers 4 and thereby creating a cut 6 of width D in the laminate 1; applying a conductive coating 7 covering the upper surface of the laminate 1, and further covering all surfaces of the cut 6, the conductive coating 7 contacting the uppermost conductive layer 4 in the laminate 1; singulating the moulded module strip 10 into separate electronic modules 9 by cutting all the way through the laminate 1 by creating a second cut in said first cut 6, the second cut having a width d smaller than the width D of the first cut 6. The invention also relates to such electronic module.