Method of manufacturing SnZnNiCu solder powder by gas atomization, and solder powder

The present invention is a method to manufacture the SnZnNiCu solder powder through liquid quenching atomizing method, and an atomizing temperature is not less than 500°C, in particular, not less than 900°C. The raw material metal used as raw material of the solder powder comprises 3 to 12 % by weig...

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Bibliographische Detailangaben
Hauptverfasser:	KUMAMOTO, SEISHI, MATSUBARA, EIICHIRO, IRIE, HISAO, ICHITSUBO, TETSU, ANADA, TAKAAKI
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASTING CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS POWDER METALLURGY SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM WORKING METALLIC POWDER
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Beschreibung
Zusammenfassung:	The present invention is a method to manufacture the SnZnNiCu solder powder through liquid quenching atomizing method, and an atomizing temperature is not less than 500°C, in particular, not less than 900°C. The raw material metal used as raw material of the solder powder comprises 3 to 12 % by weight of Zn, 1.0 to 15 % by weight of the sum of Cu and Ni, and Sn and inevitable impurities for the rest, to the total amount of raw material. The powder may further contain one or more of Bi, In, Sb, Mg, Ag, Au, in a total amount of up to 5% by weight. Thereby, high joint strength is achieved and the SnZnNiCu solder powder which can improve joint reliability of solder joint part is provided. The solder powder has a mean particle size from 5 to 100 microns.