Method of mounting passive and active components and correspnding integrated circuit

The circuit has a sub-assembly (1) comprising passive components e.g. capacitor (6). A sub-assembly (8) with active components (11) is manipulated by using a rigid substrate. The sub-assembly (8) is bonded on the sub-assembly (1) by a thick oxide layer (15) by using a low temperature molecular bonding process. The layer (15) is obtained by fixation of an oxide layer of the sub-assembly (1) with an insulation layer of the sub-assembly (8), where the insulation layer is made of silicon dioxide. Interconnection levels (17, 18) are located between the sub-assemblies (1, 8). An independent claim is also included for a method of manufacturing an integrated circuit. La présente invention concerne un circuit intégré comprenant au moins deux sous-ensembles, un sous-ensemble 8 comprenant des composants actifs 11, un sous-ensemble 1 comprenant des composants passifs 6, ledit sous-ensemble 1 comprenant des composants passifs étant fixé sous ledit sous-ensemble comprenant des composants actifs 11 et dans lequel des interconnexions 16 s'étendent d'un sous-ensemble 8 comprenant des composants actifs 11 à un sous-ensemble 1 comprenant des composants passifs.