METHOD FOR ELECTROPLATING BATH CHEMISTRY CONTROL

A method for controlling the chemical composition of an electroplating bath solution used to plate a plurality of substrates by providing the electroplating bath solution to a small-volume plating cell configured to minimize additive breakdown, and discarding the electroplating bath after a predeter...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SUN, ZHI-WEN, BEHNKE, JOSEPH F, ROSENFELD, ARON, HAFEZI, HOOMAN, YANG, MICHAEL
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAININGELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN,SULFUR, SELENIUM OR TELLURIUM APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY EDIBLE OILS OR FATS, e.g. MARGARINES, SHORTENINGS, COOKINGOILS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOODS OR FOODSTUFFS HUMAN NECESSITIES METALLURGY ORGANIC CHEMISTRY PHOSPHATIDE COMPOSITIONS FOR FOODSTUFFS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS PROTEIN COMPOSITIONS FOR FOODSTUFFS SEMICONDUCTOR DEVICES THEIR TREATMENT, NOT COVERED BY OTHER CLASSES WORKING-UP PROTEINS FOR FOODSTUFFS
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Beschreibung
Zusammenfassung:	A method for controlling the chemical composition of an electroplating bath solution used to plate a plurality of substrates by providing the electroplating bath solution to a small-volume plating cell configured to minimize additive breakdown, and discarding the electroplating bath after a predetermined bath lifetime. The method includes predetermining a lifetime of an electroplating bath solution having a desired chemical composition, combining a plurality of electroplating bath solution components thereby forming the electroplating bath solution having the desired chemical composition, filling a small-volume plating cell with the electroplating bath solution, plating a plurality of substrates in the electroplating bath solution until the bath lifetime is reached; and discarding the electroplating bath solution after the bath lifetime is reached.