METHOD FOR PRODUCTION OF ELECTRONIC AND OPTOELECTRONIC CIRCUITS
According to the invention, in an assembly comprising an electronic component ( 108 ), said component is connected by microbeads ( 107 ) to at least one heat sink ( 106, 109 ), said beads being connected to electrically-conductive lines on said electronic component and to electrically-conductive lin...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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