METHOD FOR PRODUCTION OF ELECTRONIC AND OPTOELECTRONIC CIRCUITS

According to the invention, in an assembly comprising an electronic component ( 108 ), said component is connected by microbeads ( 107 ) to at least one heat sink ( 106, 109 ), said beads being connected to electrically-conductive lines on said electronic component and to electrically-conductive lin...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: BERNABE, STEPHANE, HAMELIN, REGIS, GARCIA, JEANARLES, ROSSAT, CYRILLE
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:According to the invention, in an assembly comprising an electronic component ( 108 ), said component is connected by microbeads ( 107 ) to at least one heat sink ( 106, 109 ), said beads being connected to electrically-conductive lines on said electronic component and to electrically-conductive lines on at least one heat sink, said beads carrying, on the one hand, electrical signals between the electronic component and each heat sink bearing said electrically-conductive lines and, on the other hand, the heat from the electronic component to each heat sink, via heat conduction.