METHOD FOR PRODUCTION OF ELECTRONIC AND OPTOELECTRONIC CIRCUITS
According to the invention, in an assembly comprising an electronic component ( 108 ), said component is connected by microbeads ( 107 ) to at least one heat sink ( 106, 109 ), said beads being connected to electrically-conductive lines on said electronic component and to electrically-conductive lin...
Gespeichert in:
Hauptverfasser: | , , , |
---|---|
Format: | Patent |
Sprache: | eng ; fre ; ger |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | According to the invention, in an assembly comprising an electronic component ( 108 ), said component is connected by microbeads ( 107 ) to at least one heat sink ( 106, 109 ), said beads being connected to electrically-conductive lines on said electronic component and to electrically-conductive lines on at least one heat sink, said beads carrying, on the one hand, electrical signals between the electronic component and each heat sink bearing said electrically-conductive lines and, on the other hand, the heat from the electronic component to each heat sink, via heat conduction. |
---|