METHOD FOR REFLOW SOLDERING

The invention relates to a method and a device for the reflow soldering of circuit-board conductors with components and modules applied to a printed-circuit board by means of a solder paste, wherein, through radiation of an electromagnetic wave, an absorption material absorbing the radiation is heat...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	DIEHM, ROLF, LETTNER, HORST
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	The invention relates to a method and a device for the reflow soldering of circuit-board conductors with components and modules applied to a printed-circuit board by means of a solder paste, wherein, through radiation of an electromagnetic wave, an absorption material absorbing the radiation is heated and said heating is transferred to the solder paste for melting a solder contained in the solder paste. The solder paste is mixed with the absorption material to form a mixed material and the mixed material is applied to the soldering joints of the circuit-board conductors.