THERMOPLASTIC RESIN COMPOSITION AND RESIN MOLDING

The present invention provides a thermoplastic resin composition producing an extremely small amount of outgas and providing a molded article having excellent antistaticity. The present thermoplastic resin composition comprises a thermoplastic resin and is characterized in that the amount of outgas...

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1. Verfasser: SUMIMOTO, NORIFUMI
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:The present invention provides a thermoplastic resin composition producing an extremely small amount of outgas and providing a molded article having excellent antistaticity. The present thermoplastic resin composition comprises a thermoplastic resin and is characterized in that the amount of outgas is 1500 µg/g or less. The composition may comprise a surface resistivity reducing substance in an amount of 0.1 to 70 parts by mass relative to 100 parts by mass of the thermoplastic resin. The present invention is suitable to a composition comprising a styrenic resin as the thermoplastic resin. The surface resistivity reducing substrate is preferably a polyamide elastomer comprising a hard segment formed of polyamide 12 and a soft segment formed of poly(alkylene oxide)glycol. The polyamide elastomer preferably has a refractive index of 1.5 to 1.53, a melting point of 130 to 160°C, a solution viscosity of 1.35 to 1.70 and a surface resistivity of 1 × 10 8 to 1 × 10 11 ©.