A PROCESS OF IMAGING A DEEP ULTRAVIOLET PHOTORESIST WITH A TOP COATING

The present invention relates to a process for imaging deep ultraviolet (uv) photoresists with a topcoat using deep uv immersion lithography. The invention further relates to a topcoat composition comprising a polymer with at least one ionizable group having a pKa ranging from about -9 to about 11....

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Bibliographische Detailangaben
Hauptverfasser: DAMMEL, Ralph, R, SAKAMURI, Raj, ROMANO, Andrew, R, HOULIHAN, Francis, M
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:The present invention relates to a process for imaging deep ultraviolet (uv) photoresists with a topcoat using deep uv immersion lithography. The invention further relates to a topcoat composition comprising a polymer with at least one ionizable group having a pKa ranging from about -9 to about 11. The invention also relates to a process for imaging a photoresist with a top barrier coat to prevent contamination of the photoresist from environmental contaminants.