TWO-COMPONENT ADHESION PROMOTER COMPOSITION AND USE OF PACKAGING COMPRISING TWO COMPARTMENTS

Two components coupling composition (I), for surface pretreatment, comprises component (C1) (at least a hydrolyzable coupling substance A comprising organosilicon compound, organotitanium compound and/or organozirconium compounds) and component (C2) (at least a compound B that reacts/catalysts conde...

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Bibliographische Detailangaben
Hauptverfasser:	HUCK, WOLF-RUEDIGER, ZINGERLE, GERHARD, JUNGE, STEFAN, TRABESINGER, GERALD
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS CONVEYING DYES HANDLING THIN OR FILAMENTARY MATERIAL METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PACKAGES PACKAGING ELEMENTS PACKING PAINTS PERFORMING OPERATIONS POLISHES STORING THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	Two components coupling composition (I), for surface pretreatment, comprises component (C1) (at least a hydrolyzable coupling substance A comprising organosilicon compound, organotitanium compound and/or organozirconium compounds) and component (C2) (at least a compound B that reacts/catalysts condensation of (A)), where C1 and (C2) are present in unopened condition in two chambers, separated from each other by a partition. Independent claims are also included for: (i) use of a packaging comprising two chambers for storing the two components (C1 and C2) and a partition for separating the two components from each other; (ii) packing comprising the packaging and (I); and (iii) a method for applying (I) for surface pretreatment comprising applying pressure on the partition by applying pressure (which breaks the partition), contacting the two components through an opening (optionally by removing a cover) and applying (I) on the substrate surface.