Backlight unit having light emitting diodes and method for manufacturing the same

In a backlight unit having light emitting diodes, the generation of hot spots is avoided without recourse to use of a conventional lateral light emitting diode package so as to provide improved picture quality. A method of manufacture of such a unit dispenses with the need for an assembling process...

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Bibliographische Detailangaben
Hauptverfasser:	Yee, Young joo, Jang, Jun ho
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF HEATING LIGHTING MECHANICAL ENGINEERING NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS SEMICONDUCTOR DEVICES STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF WEAPONS
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Beschreibung
Zusammenfassung:	In a backlight unit having light emitting diodes, the generation of hot spots is avoided without recourse to use of a conventional lateral light emitting diode package so as to provide improved picture quality. A method of manufacture of such a unit dispenses with the need for an assembling process of placing a hot spot baffle plate, thereby simplifying the manufacturing process of a backlight unit. The absence of the baffle plate allows the thickness of the backlight unit to be reduced.