MOLDING OF RESIN FOR CUTTING OPERATION, MATERIAL FOR FORMATION THEREOF AND MODEL

A machinable resin molded product having a charge half-life of 1 to 60 seconds and a Water content of 0.05 to 1.0 wt%, a model obtained by cutting the resin molded product, and a machinable resin-forming material comprising a hard resin component (A) and a non-silicone surfactant (B) are provided, w...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	SASATANI, YUICHI, MIURA, KIMIO, AWAHARA, MASAKI
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A machinable resin molded product having a charge half-life of 1 to 60 seconds and a Water content of 0.05 to 1.0 wt%, a model obtained by cutting the resin molded product, and a machinable resin-forming material comprising a hard resin component (A) and a non-silicone surfactant (B) are provided, whereby a machinable resin-forming material such that powder or dust generated from the same in a cutting process does not adversely affect electronically controlled circuits of a processing machine, thereby not causing malfunctions, accidental stops, etc. of the processing machine, a machinable resin molded product made of the foregoing resin-forming material, and a model obtained by cutting the molded product are provided.