POSITIVE LIGHT-SENSITIVE RESIN COMPOSITION AND RELIEF PATTERN USING THE SAME

The invention provides a composition that is almost insoluble in alkali developers before exposure to light, but becomes highly soluble in alkali developers when exposed to light and that can form a fine, high-resolution pattern, to serve for production of an accurate lens shape with a high transpar...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SUWA, MITSUHITO, MINAMIHASHI, KATSUYA
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:The invention provides a composition that is almost insoluble in alkali developers before exposure to light, but becomes highly soluble in alkali developers when exposed to light and that can form a fine, high-resolution pattern, to serve for production of an accurate lens shape with a high transparency and a high refractive index that can be used to produce optical devices. The invention uses a positive photosensitive resin composition comprising: (a) 100 parts by weight of a polymer that has an alkali-soluble group, (b) 1-30 parts by weight of a compound that absorbs light with the wavelength used for exposure, but is not bleached by the light, (c) 1-50 parts by weight of a quinone diazide compound, and (d) 5-500 parts by weight of particles of at least one inorganic substance selected from the group of an aluminum compound, silicon compound, tin compound, titanium compound and zirconium compound with a diameter in the range of 1 nm to 30 nm.