Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method, and kit for preparing chemical mechanical polishing aqueous dispersion

A chemical mechanical polishing aqueous dispersion, including: (A) inorganic particles; (B) at least one type of particles selected from the group consisting of organic particles and organic-inorganic composite particles; (C) at least one compound selected from the group consisting of quinolinecarbo...

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Bibliographische Detailangaben
Hauptverfasser: HATTORI, MASAYUKI, KONNO, TOMOHISA, UCHIKURA, KAZUHITO, KAWAHASHI, NOBUO
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:A chemical mechanical polishing aqueous dispersion, including: (A) inorganic particles; (B) at least one type of particles selected from the group consisting of organic particles and organic-inorganic composite particles; (C) at least one compound selected from the group consisting of quinolinecarboxylic acid, quinolinic acid, a divalent organic acid (excluding quinolinic acid), and a hydroxyl acid; (D) at least one compound selected from the group consisting of benzotriazole and benzotriazole derivatives; (E) an oxidizing agent; and (F) water, the chemical mechanical polishing aqueous dispersion containing the component (A) in an amount of 0.05 to 2.0 wt% and the component (B) in an amount of 0.005 to 1.5 wt%, having a ratio (W A /W B ) of the amount (W A ) of the component (A) to the amount (W B ) of the component (B) of 0.1 to 200, and having a pH of 1.0 to 5.0.