Method of manufacturing a MICROELECTRONIC INTERCONNECT DEVICE COMPRISING LOCALISED CONDUCTIVE PINS

Method of manufacturing a MICROELECTRONIC INTERCONNECT DEVICE COMPRISING LOCALISED CONDUCTIVE PINS

Fabrication of conducting pins (310) endowed with one or more conductor contacts (302), each coming into contact with an electronic component contact, comprises: (a) deposition of a masking layer on a component; (b) formation of holes in the masking layer; (c) filling these holes with a conducting m...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: FRANIATTE, REMI, BRUN, JEAN, PUGET, CHRISTIANE
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Fabrication of conducting pins (310) endowed with one or more conductor contacts (302), each coming into contact with an electronic component contact, comprises: (a) deposition of a masking layer on a component; (b) formation of holes in the masking layer; (c) filling these holes with a conducting material to form the conducting pins; (d) removing the masking layer. An independent claim is also included for micro-electronic devices obtained by this method.