METHOD FOR MAKING CHIP-SIZED FLIP-CHIP SEMICONDUCTOR PACKAGE

METHOD FOR MAKING CHIP-SIZED FLIP-CHIP SEMICONDUCTOR PACKAGE

A semiconductor package (10; 14) comprises a semiconductor die (2; 2') with a plurality of contact areas (4) on its active surface and an electrically conductive bump (7) on each contact area (4). The die (2; 2') and electrically conductive bumps (7) are encapsulated in a plastic housing (...

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Bibliographische Detailangaben
Hauptverfasser: KEONG, BUN-HIN, MOHAMED, ABDUL, RAHMAN, GOH, KOH-HOO
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Zusammenfassung:A semiconductor package (10; 14) comprises a semiconductor die (2; 2') with a plurality of contact areas (4) on its active surface and an electrically conductive bump (7) on each contact area (4). The die (2; 2') and electrically conductive bumps (7) are encapsulated in a plastic housing (11) so that the plastic housing (11) encapsulates at least sides of the die (2; 2') and sides of the electrically conductive bumps (7).