Silver particle powder and method of manufacturing same

A fine silver particle powder is provided that is a suitable material for interconnects used to form fine circuit patterns especially by the inkjet method, and a method of manufacturing the powder. Although the powder is fine and therefore has a large specific surface area, it has good weatherability and corrosion resistance. The powder particles have a calculated specific surface area (CS) of 50 m 2 /cm 3 or more, an X-ray crystal grain diameter (Dx) of not more than 50 nm, not more than 10.0 basicity points/nm 2 and not more than 10.0 acidity points/nm 2 . To obtain the silver particle powder, a silver compound is reduced in an organic solvent, using as the reducing agent one, two or more selected from an alcohol or polyol. The reduction reaction proceeds in the presence of an organic protective agent and a polarity inhibition agent.