Multilayer printed wiring board
This invention is to provide a multilayer printed wiring board capable of effectively solving the swelling of the conductor layer resulted from the residual solvent and the lowering of adhesion property between resin insulating layer and conductor, and proposes a multilayer printed wiring board form...
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| Format: | Patent |
| Sprache: | eng ; fre ; ger |
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| Zusammenfassung: | This invention is to provide a multilayer printed wiring board capable of effectively solving the swelling of the conductor layer resulted from the residual solvent and the lowering of adhesion property between resin insulating layer and conductor, and proposes a multilayer printed wiring board formed by laminating resin insulating layers and conductor layers on a substrate, characterized in that among conductor layers at least constituted with signal layer and power layer, a conductor pattern of the power layer is lattice-shaped form. |
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