SEMICONDUCTOR COMPONENT COMPRISING SYNTHETIC HOUSING MATERIAL, SEMICONDUCTOR CHIP AND CIRCUIT SUPPORT, AND METHOD FOR PRODUCING THE SAME

SEMICONDUCTOR COMPONENT COMPRISING SYNTHETIC HOUSING MATERIAL, SEMICONDUCTOR CHIP AND CIRCUIT SUPPORT, AND METHOD FOR PRODUCING THE SAME

A semiconductor device with a plastic package molding compound, a semiconductor chip and a leadframe is disclosed. In one embodiment, the semiconductor chip is embedded in a plastic package molding compound. The upper side of the semiconductor chip and the plastic package molding compound are arrang...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: HETZEL, WOLFGANG, THOMAS, JOCHEN
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A semiconductor device with a plastic package molding compound, a semiconductor chip and a leadframe is disclosed. In one embodiment, the semiconductor chip is embedded in a plastic package molding compound. The upper side of the semiconductor chip and the plastic package molding compound are arranged on a leadframe. Arranged between the leadframe and the plastic package molding compound with the semiconductor chip is an elastic adhesive layer for the mechanical decoupling of an upper region from a lower region of the semiconductor device.