CHEMICAL-MECHANICAL POLISHING (CMP) SLURRY AND METHOD OF PLANARIZING SURFACES

A chemical-mechanical abrasive composition for use in semiconductor processing uses abrasive particles having a non-spherical morphology.

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Bibliographische Detailangaben
Hauptverfasser:	IANIRO, MICHAEL, R, EISENHOUR, DON, FANG, MINGMING
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS POLISHES POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SEMICONDUCTOR DEVICES SKI WAXES
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Beschreibung
Zusammenfassung:	A chemical-mechanical abrasive composition for use in semiconductor processing uses abrasive particles having a non-spherical morphology.