METHOD OF FORMING A SEMICONDUCTOR PACKAGE AND STRUCTURE THEREOF

An electromagnetic interference (EMI) and/or electromagnetic radiation shield is formed by forming a conductive layer ( 42, 64 ) over a mold encapsulant ( 35, 62 ). The conductive layer ( 42, 64 ) may be electrically coupled using a wire to the leadframe ( 10, 52 ) of the semiconductor package ( 2, 50 ). The electrical coupling can be performed by wire bonding two device portions ( 2, 4, 6, 8 ) of a leadframe ( 10 ) together and then cutting the wire bond ( 32 ) by forming a groove ( 40 ) in the overlying mold encapsulant ( 35 ) to form two wires ( 33 ). The conductive layer ( 42 ) is then electrically coupled to each of the two wires ( 33 ). In another embodiment, a looped wire bond ( 61 ) is formed on top of a semiconductor die ( 57 ). After mold encapsulation, portions of the mold encapsulant ( 62 ) are removed to expose portions of the looped wire bond ( 61 ). The conductive layer ( 64 ) is then formed over the mold encapsulant ( 62 ) and the exposed portion of the looped wire bond ( 61 ) so that the conductive layer ( 64 ) is electrically coupled to the looped wire bond ( 61 ).