Plating system for semiconductor materials

A semiconductor workpiece processing tool (10) includes a processing module (20) having particular applicability to an electroplating process for semiconductor wafers. The processing module (20) has plural processing bowls assemblies (603) each having an outer bowl (616) and an inner cup (620). Flui...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SCHMIDT, WAYNE J, BERNER, ROBERT W, WOODRUFF, DANIEL J
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES
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