Plating system for semiconductor materials

A semiconductor workpiece processing tool (10) includes a processing module (20) having particular applicability to an electroplating process for semiconductor wafers. The processing module (20) has plural processing bowls assemblies (603) each having an outer bowl (616) and an inner cup (620). Flui...

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Bibliographische Detailangaben
Hauptverfasser:	SCHMIDT, WAYNE J, BERNER, ROBERT W, WOODRUFF, DANIEL J
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A semiconductor workpiece processing tool (10) includes a processing module (20) having particular applicability to an electroplating process for semiconductor wafers. The processing module (20) has plural processing bowls assemblies (603) each having an outer bowl (616) and an inner cup (620). Fluid is provided to the cup (620) through an opening (628) in the bottom. Fluid overflows the cup (620) and drains into a fluid reservoir (604). Reservoir (604) is preferably used as both the supply and the return for the process fluid. Filters (630) can be included in each cup to filter process fluid entering the cup. The plurality of the processing bowls can have a common reservoir.