METHOD FOR SEPARATING FLAT CERAMIC WORKPIECES WITH A CALCULATED RADIATION SPOT LENGTH

The invention is directed to a method for splitting a flat ceramic workpiece through provocation of a separation crack due to stresses occurring as a result of temporal and local application of heat by means of laser along a desired splitting line and, following this, a temporal and local removal of...

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Bibliographische Detailangaben
Hauptverfasser:	ULLMANN, RONNY, WEISSER, JUERGEN, ACKER, STEFAN
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING CUTTING-OUT ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GLASS HAND CUTTING TOOLS MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MINERAL OR SLAG WOOL PERFORATING PERFORMING OPERATIONS PRINTED CIRCUITS PUNCHING SEMICONDUCTOR DEVICES SEVERING SEVERING BY MEANS OTHER THAN CUTTING SOLDERING OR UNSOLDERING STAMPING-OUT TRANSPORTING WELDING WORKING BY LASER BEAM WORKING CEMENT, CLAY, OR STONE WORKING STONE OR STONE-LIKE MATERIALS
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Beschreibung
Zusammenfassung:	The invention is directed to a method for splitting a flat ceramic workpiece through provocation of a separation crack due to stresses occurring as a result of temporal and local application of heat by means of laser along a desired splitting line and, following this, a temporal and local removal of heat by means of a coolant, wherein the beam spot length is calculated from the following formula l=8xdx24/WLF, where l is the length of the beam spot, WLF is the thermal conductivity of the ceramic to be split, and d is the thickness of the ceramic to be split, so that the length of the beam spot generated on the workpiece by the laser is selected depending upon the thermal conductivity of the ceramic and upon the thickness of the workpiece. Particularly with workpieces with high internal stress, process parameters such as the laser power or the forward feed speed are changed over the course of the process in order to influence the magnitude of the induced thermal stresses.