INTEGRATED ELECTROMECHANICAL ARRANGEMENT AND METHOD OF PRODUCTION

It is an object of the invention to provide a electromechanical structure comprising an input device and a printed wired board ( 3, 4 ), which structure is advantageous in terms of manufacturing and offers freedom to the layout design of the printed wired board, the user interface as well as the app...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	NAERHI, KATRI, TAKALA, ROOPE, TANSKANEN, PIA, NOUSIAINEN, JARI, AHLGREN, PENTTI
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SWITCHES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY EMERGENCY PROTECTIVE DEVICES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PHYSICS PRINTED CIRCUITS RELAYS SELECTORS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	It is an object of the invention to provide a electromechanical structure comprising an input device and a printed wired board ( 3, 4 ), which structure is advantageous in terms of manufacturing and offers freedom to the layout design of the printed wired board, the user interface as well as the appearance of the device itself. It is also an object of the invention to provide a electromechanical structure that is compact and facilitates the customizability and upgradability with a new electronic functionality without any need for modifications to the main electronics of the device. This is achieved by integrating the electromechanical assembly with the mechanical cover part of the electronic device by using an injection moulding process to compose an integrated combination ( 113 ) which is detachable from the electronic device. More precisely the objects of the invention are achieved by combining the injection mould technologies with the printing of electronic wired boards.