LITHOGRAPHIC METHOD FOR PRODUCING MICROCOMPONENTS

The invention relates to a lithographic method for producing microcomponents having a submillimeter structure, whereby the resist material can be dissolved in a simple manner. According to the invention, a structurable adhesive layer is applied to a metallic starting layer, a layer consisting of pho...

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Bibliographische Detailangaben
Hauptverfasser:	SCHEURER, JOERG, SINGLETON, LAURENCE
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR MICROSTRUCTURAL TECHNOLOGY ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS TRANSPORTING
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Beschreibung
Zusammenfassung:	The invention relates to a lithographic method for producing microcomponents having a submillimeter structure, whereby the resist material can be dissolved in a simple manner. According to the invention, a structurable adhesive layer is applied to a metallic starting layer, a layer consisting of photostructurable epoxy resin is applied to the adhesive layer, and the epoxy resin is structured by means of selective illumination and dissolution of the unexposed regions in order to create supporting structures and free spaces between the supporting structures. Only the free spaces provided for the microcomponent and located between the epoxy resin supporting structures are then filled with metal according to a galvanic method, and the epoxy resin is removed, the remaining free spaces being filled with etching agents.