Method for the electrolytic deposition of copper

The flow rate of the electrolyte of the matting process is significantly increased by treating with an electrolyte containing copper in an acid (Copper alkydsulphate).

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Bibliographische Detailangaben
Hauptverfasser:	KLEINFELD, MARLIES DR, VAN WIJNGAARDEN, CHRISTEL, SCHOETTLE, MARCO, HEYER, JOACHIM DR
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	The flow rate of the electrolyte of the matting process is significantly increased by treating with an electrolyte containing copper in an acid (Copper alkydsulphate).