Fluid cooled encapsulated microelectronic package
An encapsulated microelectronic package includes a fluid conducting cooling tube (22) directly coupled to one or more semiconductor chips (12, 14, 16), with the encapsulant (34) being molded over the semiconductor chips (12, 14, 16) and portions of the cooling tube (22) in proximity to the semicondu...
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| Format: | Patent |
| Sprache: | eng ; fre ; ger |
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| Zusammenfassung: | An encapsulated microelectronic package includes a fluid conducting cooling tube (22) directly coupled to one or more semiconductor chips (12, 14, 16), with the encapsulant (34) being molded over the semiconductor chips (12, 14, 16) and portions of the cooling tube (22) in proximity to the semiconductor chips (12, 14, 16). The encapsulant (34) immobilizes the cooling tube (22) with respect to the semiconductor chips (12, 14, 16), and the cooling tube (22) and encapsulant (34) are designed to minimize differences in their coefficients of thermal expansion relative to the semiconductor chips (12, 14, 16). |
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