Process for perforating a substrate

The substrate is positioned by a holding frame during processing. The method involves determining coordinates of a reference point in a central region, spaced apart from the holding frame. The spacing between the respective positions of the openings and the reference point is determined and used to...

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Bibliographische Detailangaben
1. Verfasser:	WENKE, STEPHAN
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING LINING MACHINES MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTING PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTINGSURFACES SOLDERING OR UNSOLDERING STAMPS TRANSPORTING TYPEWRITERS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	The substrate is positioned by a holding frame during processing. The method involves determining coordinates of a reference point in a central region, spaced apart from the holding frame. The spacing between the respective positions of the openings and the reference point is determined and used to derive the order of the spacings from the reference point. This order is used in a processing program when the openings are formed.