SEMICONDUCTOR DEVICE COMPRISING AN INTERPOSER AND MANUFACTURING METHOD THEREOF

An interposer (10) to be interposed between a semiconductor chip (1) to be mounted thereon and a packaging board (51) has an interposer portion (11) made of a semiconductor and an interposer portion (12) provided around the foregoing interposer portion (11) integrally therewith. On both surfaces of...

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Bibliographische Detailangaben
Hauptverfasser:	Wakabayashi, Shinichi, Fukase, Katsuya
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	An interposer (10) to be interposed between a semiconductor chip (1) to be mounted thereon and a packaging board (51) has an interposer portion (11) made of a semiconductor and an interposer portion (12) provided around the foregoing interposer portion (11) integrally therewith. On both surfaces of the interposer portions (11, 12), wiring patterns (14a, 14b, 15a, 15b) are formed via insulating layers (13a, 13b). The wiring patterns are electrically connected via through holes formed at required positions in the interposer portions. The outer interposer portion (12) is made of an insulator (resin) or a metal body. Further, external connection terminals (16) are bonded to one surface of the interposer (10).