Hermetic seal cover and manufacturing method thereof

A hermetic seal cover capable of inhibiting defects such as voids from generating in sealing a package, and a method of manufacturing the seal cover are provided. The hermetic seal cover comprises: a seal cover main body; a Ni plating layer applied onto a surface of the seal cover main body; and a Au-Sn brazing material layer fusion bonded to a surface of the Ni plating layer, and is characterized by a Ni-Sn ally layer disposed between the Ni plating layer and the Au-Sn brazing material layer. It is preferable if the Ni-Sn alloy layer has a thickness of 0.6-5.0µm. It is also preferable if Au-Sn brazing material layer has a Sn content of 20.65-23.5wt%.