Cerium oxide abrasive and method of polishing substrates

This invention relates to a cerium oxide abrasive and a method of polishing substrates. The present invention provides a cerium oxide 1 abrasive that can polish the surfaces of objects such as SiO 2 insulating films without causing scratches and at a high rate, and also provides a method of polishin...

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Bibliographische Detailangaben
Hauptverfasser:	YOSHIDA, MASATO, MATSUZAWA, JUN, TERESAKI, HIROKI, OOTUKI, YUUTO, TANNO, KIYOHITO, KURATA, YASUSHI, ASHIZAWA, TORANOSUKE
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM,CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THERARE-EARTH METALS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INORGANIC CHEMISTRY MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS POLISHES POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH PREPARATION OF CARBON BLACK SEMICONDUCTOR DEVICES SKI WAXES TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS,TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES
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Beschreibung
Zusammenfassung:	This invention relates to a cerium oxide abrasive and a method of polishing substrates. The present invention provides a cerium oxide 1 abrasive that can polish the surfaces of objects such as SiO 2 insulating films without causing scratches and at a high rate, and also provides a method of polishing substrates.