Electrical anisotropic conductable hot-melt adhesive for implanting electric modules in a card body

Adhesive film with layer(s) of heat-activatable adhesive, especially for fixing electrical modules in cards, in which the adhesive system has a softening point of 65-165[deg]C and contains electrically conductive particles with a copper or nickel core and an average diameter of 25-100 microns, which...

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Bibliographische Detailangaben
Hauptverfasser:	HUSEMANN, MARC, KLOSE, MAREN
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPUTING COUNTING DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING HANDLING RECORD CARRIERS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PERFORMING OPERATIONS PHYSICS POLISHES PRESENTATION OF DATA PRINTED CIRCUITS RECOGNITION OF DATA RECORD CARRIERS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF MATERIALS AS ADHESIVES WORKING-UP
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Beschreibung
Zusammenfassung:	Adhesive film with layer(s) of heat-activatable adhesive, especially for fixing electrical modules in cards, in which the adhesive system has a softening point of 65-165[deg]C and contains electrically conductive particles with a copper or nickel core and an average diameter of 25-100 microns, which is greater than the thickness of the adhesive layer.