OPTICAL MODULE, COMPRISING PRINTED WIRING BOARD, LEAD FRAME AND MULTI-CHANNEL OPTICAL SEMICONDUCTOR ELEMENT AND METHOD FOR MANUFACTURING SAME

A printed wiring board (10) includes a plurality of conductor plates (10a) spaced apart from one another including at least one conductor plate that is used as a lead for electrical connection with an external circuit; an insulating layer (10b) formed on or astride the conductor plates or on and ast...

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Bibliographische Detailangaben
Hauptverfasser:	SHIRAI, Takehiro, IWASE, Masayuki
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CURRENT COLLECTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A printed wiring board (10) includes a plurality of conductor plates (10a) spaced apart from one another including at least one conductor plate that is used as a lead for electrical connection with an external circuit; an insulating layer (10b) formed on or astride the conductor plates or on and astride the conductor plates; and a plurality of wiring patterns (10d) formed on the insulating layer. At least one of the conductor plates is electrically connected with at least one of the wiring patterns via a via-hole (11a), a method of manufacturing the printed wiring board, and a lead frame package and an optical module that use the printed wiring board.