Method of manufacturing a sealed electronic module

A sealed electronic module (26) is manufactured by forming a housing (18) that is open at one end (18b), dispensing a first quantity of potting material (20) into the housing (18) via the open end (18b), inserting a circuit board (12) and electrical connector assembly (16) into the housing (18) so t...

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Bibliographische Detailangaben
1. Verfasser:	HUNKELER, HUGH R
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CURRENT COLLECTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING VEHICLES IN GENERAL VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISEPROVIDED FOR WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	A sealed electronic module (26) is manufactured by forming a housing (18) that is open at one end (18b), dispensing a first quantity of potting material (20) into the housing (18) via the open end (18b), inserting a circuit board (12) and electrical connector assembly (16) into the housing (18) so that the inboard end (12b) of the circuit board (12) is immersed in the potting material (20), and dispensing a second quantity of potting material (30) into an area (28) bridging the connector assembly (16) and the housing (18). When cured, the first quantity of potting material (20) attaches the inboard end (12b) of the circuit board (12) to the housing (18), and the second quantity of potting material (30) attaches the connector (16) to the housing (18) and environmentally seals the module (26).