Sensor device

A sensor device (S1) includes a sensor chip (20) and a bonding wire (40) being fixed on a substrate (10). The sensor device (S1) is manufactured by using a binding material (30) made of an adhesive (32) containing a foaming agent (31 a) that evaporates upon exposure to heat. The binding material (30...

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Bibliographische Detailangaben
1. Verfasser:	SAITOU, TAKASHIGE
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT MEASURING MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION,OR SHOCK MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR PHYSICS SEMICONDUCTOR DEVICES TARIFF METERING APPARATUS TESTING
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Beschreibung
Zusammenfassung:	A sensor device (S1) includes a sensor chip (20) and a bonding wire (40) being fixed on a substrate (10). The sensor device (S1) is manufactured by using a binding material (30) made of an adhesive (32) containing a foaming agent (31 a) that evaporates upon exposure to heat. The binding material (30) reduces its elasticity after a wire bonding process because voids (31) being functional as a cushion are formed by evaporation of the foaming agent (31a).