Dual-sided substrate integrated circuit package including a leadframe having leads with increased thickness

An integrated circuit package (10) includes a first non-conductive substrate (20) having a first inner surface (32) and a second non-conductive substrate (22) having a second inner surface (46). A die (18) having a first thickness (52) is disposed between the first and second inner surfaces. A leadf...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	GERBSCH, ERICH W, MOCK, ROGER A
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!